SPP600S
Polishing Machine – quipped with a wide range of software for research and development.
Concept
User-friendly CMP equipment designed with ease of use and environmental considerations in mind
Feature
・This manual-type CMP system is ideal for research and development applications. It supports various pressure control methods based on either the front or back surface. Its user-friendly interface allows you to monitor all processing conditions on a single screen.
・Primary time settings ensure consistently stable data collection. Data obtained from this unit can be linked with the fully automatic polisher PNX332B and used directly.
・Even when grinding with a removal rate of 10μm or more, wafer shape will not be compromised. It features a dedicated dresser spindle and is compatible with diamond dressers.
Furthermore, it features environmentally conscious design elements such as a slurry recycling mechanism.
Technical Specifications
| Max. workpiece / wafer size (mm) | Ø200 |
| Max. wafer size (inch) | 4"–12" |
| Platen diameter (mm) | Ø600 |
| Wafers processed simultaneously (pcs) | 2 |
| Platen rotation speed (min⁻¹) | 10–80 |
| Footprint W×D×H (mm) | 1380×1110×1873 |
| Machine weight (kg) | 2100 |
