PNX332B
An automatic final polisher for 300 mm wafers that maximizes edge-profile accuracy and removal-rate uniformity to the highest possible level.
CONCEPT
A final polisher that adopts a specially structured polishing head and transport mechanism, enabling stable wafer processing with high precision and high throughput.
FEATURES
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Best-selling 300 mm final polisher.
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Achieves atomic-level ultra-mirror and ultra-high brightness polishing.
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With three polish tables, this high-productivity machine simultaneously polishes six wafers from intermediate to finishing stages, and uses an indexing transport system to move four wafers at the same time.
Technical Specifications
| Maximum wafer size (mm) | Ø300 mm |
| Wafers processed simultaneously (pcs) | 10 |
| Polishing tables / stages | 3 tables, 6 wafers polished at once |
| Transport method | Indexing transport, 4 wafers moved at once |
| Application | Silicon wafer final polishing |
