SVG401H
Grinding Machine – Space-saving and multi-functional machine.
Concept
High-rigidity grinder ideal for machining difficult-to-cut materials
Feature
・Manual grinder for research and development and grinding of difficult-to-cut materials. The SVG101 features a shuttle table and is designed to facilitate manual wafer loading and unloading.
・The SVG401 performs continuous machining of difficult-to-cut materials such as sapphire and SiC, as well as compound semiconductors, utilizing its high-rigidity structure and high-horsepower built-in motor.
For batch processing of small-diameter wafers, a chuck table supporting up to 450mm diameter can be installed. (20-wafer batches of 3-inch wafers)
