GNX200B / GNX300B
The Okamoto GNX series is a high-precision double-side lapping and polishing platform designed for efficient, consistent processing of semiconductor and advanced material components.
The Okamoto GNX series is engineered for demanding double-side lapping and polishing applications, delivering high dimensional accuracy, stable throughput, and repeatable surface quality. Designed for semiconductor wafers and advanced materials, the GNX machines integrate rigid construction, precise spindle control, and optimized process stability to ensure uniform stock removal and superior flatness across a wide range of part sizes. Their automation-ready architecture and reliable performance make them suitable for both high-volume production and precision manufacturing environments.
Technical Specifications
| Maximum machining diameter (mm) | 200 |
| Spindle speed range (rpm) | 0–3600 |
| Power of spindle drive motor (kW) | 2.2 / 4 |
| Main shaft feed speed range (µm/min) | 1–999 |
| Number of spindles (pcs) | 2 |
| Working disc speed range (rpm) | 1–300 |
| Grinding wheel size (mm) | 250 |
| Equipment weight (kg) | 3,900 |
